Precision Etched Lead Frames for Semiconductor IC Packaging Custom Metal Parts

Precision Etched Lead Frames for Semiconductor IC Packaging Custom Metal Parts

Lead Frames Overview

We specialize in manufacturing high-precision lead frames using advanced metal etching technology. Our lead frames are essential components in semiconductor packaging, providing reliable electrical connectivity and heat dissipation for integrated circuits (ICs).

Custom Precision Etched Lead Frames for Semiconductor Packaging

Xinhaisen specializes in manufacturing precision etched lead frames using advanced photo chemical machining technology. Our custom metal lead frames are designed for semiconductor packaging applications requiring high accuracy, fine features and complex geometries.

Compared with traditional stamping processes, chemical etching enables burr-free edges, stress-free processing and flexible customization for various semiconductor components.

Manufacturing Process
Our lead frames are produced through precision chemical etching, which allows for burr-free, stress-free, and highly accurate results without altering the material properties.

Lead Frames Features

• Exceptional Precision: Capable of ultra-fine features, with minimum line widths down to 0.015mm and micro-hole diameters as small as 0.03mm.

• Superior Consistency: High etching uniformity (±0.03mm) ensures every part meets strict dimensional tolerances for reliable performance.

• Material Versatility: We process a wide range of metals, including Copper, Alloy 42, Kovar, and various stainless steels.

• Burr-Free & Stress-Free: The etching process produces smooth edges without mechanical stress, preventing damage to delicate chips.

• Complex Design Capability: Easily accommodates intricate and fine-pitch patterns that are challenging with other methods.

Lead Frames Specifications

Lead Frames Applications

• IC Packaging: For a broad range of integrated circuits, from logic chips to memory.

• Power Semiconductors: Critical components in MOSFETs, IGBTs, and power modules.

• Sensors & Microelectronics: Used in MEMS devices, environmental sensors, and pressure sensors.

• Automotive Electronics: Applications in ECU modules, LED lighting systems, and engine control units.

• Consumer Electronics: Found in smartphones, tablets, wearables, and other portable devices.

Our Advantages

• High Precision: Capable of ultra-fine features and tight tolerances.

• Fast Delivery: Quick response and reliable lead times, even for large orders.

• Wide Capability: Handle various metals and complex designs with consistent quality.

• Reputation: Known among clients for accuracy, speed, and versatility.

FAQ

1. Who are we?

We are based in Guangdong, China, start from 2012,sell to Domestic Market(50.00%),Central America(10.00%),North America(10.00%),Eastern Europe(10.00%),South America(10.00%),Western Europe(5.00%),Southern Europe(5.00%). There are total about 101-200 people in our office.

2. How can we guarantee quality?

• Always a pre-production sample before mass production;
• Always final Inspection before shipment.

3. What services can we provide?

• Accepted Delivery Terms: FOB,CFR,CIF,EXW；
• Accepted Payment Currency:USD,EUR,JPY,CAD,AUD,HKD,CNY;
• Accepted Payment Type: T/T,Paypal,Western Union,Cash;
• Language Spoken:English,Chinese.

Welcome to contact us at any time!

Precision etched lead frames for IC packaging

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Precision Etched Lead Frames for Semiconductor IC Packaging Custom Metal Parts Images